IAC-RV1126B-CM
Cost-Effective AI Vision Platform: Redefining Edge Intelligence
Powered by the Rockchip RV1126B processor with an integrated quad-core high-performance Cortex-A53 architecture running at up to 1.5 GHz, the Qiyang RV1126B development board delivers robust computing power for high-performance workloads and multi-tasking.
3T Computing Power with Broad Framework Compatibility
Featuring a self-developed NPU delivering up to 3 TOPS of AI performance, it seamlessly supports mainstream deep learning frameworks including TensorFlow, MXNet, PyTorch, and Caffe. It effortlessly adapts to various AI models, significantly lowering development complexity and deployment barriers.
High-Precision Connectors for Reliable and Stable Performance
Utilizing high-precision board-to-board connectors with superior shock resistance, it ensures stable and reliable connectivity, facilitating easier development, debugging, and module replacement.
Professional-Grade AI-ISP for Intelligent Image Processing
Supporting up to 12M@30fps ISP, it integrates advanced image enhancement algorithms including HDR, 3A (AE/AF/AWB), LSC, 3DNR, 2DNR, Sharpening, Defog, Fisheye Correction, and Gamma Correction. Additionally, it incorporates an 8M@30fps AI-ISP, delivering superior spatial noise reduction and enhanced image processing.
Efficient Hardware Video Codec Supporting Multi-Stream Encoding
Supports 4K@30fps H.265/H.264 video encoding/decoding and multi-stream encoding (e.g., high-resolution local video recording alongside low-resolution cloud video streaming). Its powerful video processing capabilities ensure sharper, more vivid visual details.
Rich Peripheral Interfaces for Diverse Terminal Requirements
Onboard interfaces include 6x UART, 2x CAN, 4x MIPI-CSI, 3x USB 2.0, 1x Type-C, and 1x Ethernet port (Gigabit or Fast Ethernet), fully satisfying versatile hardware expansion and application development needs.
Development Resources & Support
Data Sheets, System Images, User Manuals, Source Code, Mechanical Dimensional Drawings, Terminal Debugging Tools, Pre-configured VMware VM Images, Carrier Board Schematics & PCB Layout Files, etc.
Applications
Widely applied across industrial vision, smart homes, smart locks, automotive electronics, intelligent security, power equipment, AI toys, and other edge AI applications.
| Parameters | |||
|---|---|---|---|
| CPU | RockChip RV1126B,Quad ARM® Cortex™-A53 RV1126B, the frequency is up to 1.5GHz | RAM | 4GB LPDDR4 (8GB optional) |
| Flash | 16GB (32GB、64GB optional) | NPU | 3 TOPS |
| Ethernet | 2x network chip, including 1-ch integrated with 100Mbps MAC+PHY, another one integrated with RGMII (Either-or, only 1xMAC) | others | SPI * 1 |
| ISP | Supporting up to 12M@30fps ISP, it integrates advanced image enhancement algorithms including HDR, 3A (AE/AF/AWB), LSC, 3DNR, 2DNR, Sharpening, Defog, Fisheye Correction, and Gamma Correction. Additionally, it incorporates an 8M@30fps AI-ISP, delivering superior spatial noise reduction and enhanced image processing. | Connectivity | 4x RS232 (3-wire serial interface, two of which are multiplexed with RS485)；2x RS485 (3-wire serial port, multiplexed with RS232)；2x CAN |
| USB | 3x USB2.0 HOST ; 2x Type-A ;1x PHB2.0;1xUSB Type-C (Debug);1xUSB3.0 Type-C OTG | Other devices | Reset Circuit ,Watchdog, RTC |
| Display Interface | 1x 4-lane MIPI_DSI, 1080P@60fps | Wi-Fi | Onboard with AP6256 Wi-Fi module, support 2.4Ghz/5Ghz 802.11 a/b/g/n protocol |
| Audio | 1x balanced stereo amplifier output;2x MIC Audio Input;1x 3.5mm stereo output | Extension Interface | MINI-PCIE（USB2.0），to connect 4G , SIM card socket |
| Storage interface | 1x TF card socket | Camera | 4x MIPI-CSI 2Lane，single channel supports 1080P@30fps in max. |
| Power Supply | 9V~36V，DC_12V (Std.) | Operating System | Linux6.1, Buildroot |
| Power Consumption | 1.3W (Non-loaded) | Operating Temperature | -20℃ ~ +80℃ |
| Working Humidity | 5%~50%,non-condensation | Storage temperature | -20℃ ~ +90℃ |
| Dimensions(mm) | SOM Size:40mm*47mm 8-layer high precision immersion gold technology;Carrier Board Size:125mm*180mm 4-layer high precision immersion gold technology | ||
| Specification | |||
|---|---|---|---|
| J3 | 3.3V/1.8V jumper wire | J4 | GPIO |
| J5 | USB Debug | J6 | TF Card |
| J7 | USB3.0 OTG | J8 | USB2.0 |
| J9 | USB2.0 | J10 | MINI PCIE(USB2.0) |
| J12 | Gigabit Ethernet | J13 | 100Mbps Ethernet |
| J14 | MIPI-DSI | J15 | MIPI-CSI |
| J16 | MIPI-CSI | J17 | MIPI-CSI |
| J18 | MIPI-CSI | J19 | HeadPhone |
| J20 | MIC | J21 | MIC |
| J22 | Speaker | J23 | Speaker |
| J24 | RS232 | J25 | RS232 |
| J26 | 120Ω jumper wire | J27 | RS485 |
| J28 | 120Ω jumper wire | J29 | RS485 |
| J30 | RS232 | J31 | RS232 |
| J32 | CAN | J33 | CAN |
| J34 | SPI | J35 | power input |
| BT1 | RTC | SW1 | Reset Button |
| SW2 | Recovery Button | SW3 | MASKROM Button |
| D23 | indicator | S1 | SIM card socket |
| U12 | Wi-Fi/BT module | ||
Product Hardware Manual